Semiconductor device with self-aligned vias

ABSTRACT

A method of forming a semiconductor device includes forming a conductive line over a substrate; forming an etch stop layer (ESL) over the conductive line, the ESL extending continuously along an upper surface of the conductive line and along an upper surface of a first dielectric layer adjacent to the conductive line, where a first lower surface of the ESL contacts the upper surface of the conductive line, and a second lower surface of the ESL contacts the upper surface of the first dielectric layer, the first lower surface being closer to the substrate than the second lower surface; forming a second dielectric layer over the ESL; forming an opening in the second dielectric layer, the opening exposing a first portion of the ESL; removing the first portion of the ESL to expose the conductive line; and filling the opening with an electrically conductive material to form a via.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a continuation of U.S. patent application Ser. No.16/275,109, filed Feb. 13, 2019, entitled “Semiconductor Device withSelf-Aligned Vias”, which claims priority to U.S. Provisional PatentApplication No. 62/753,496, filed Oct. 31, 2018, entitled “SemiconductorDevice with Self-Aligned Vias,” which applications are herebyincorporated by reference in their entireties.

BACKGROUND

The semiconductor industry has experienced rapid growth due tocontinuous improvements in the integration density of a variety ofelectronic components (e.g., transistors, diodes, resistors, capacitors,etc.). For the most part, this improvement in integration density hascome from repeated reductions in minimum feature size, which allows morecomponents to be integrated into a given area. As the feature size ofsemiconductor devices continues to shrink and the integration densitycontinues to increase, more challenges are faced in semiconductormanufacturing.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1-9 are cross-sectional views of a semiconductor device at variousstages of manufacturing, in accordance with an embodiment.

FIG. 10 illustrates an alternative cross-sectional view of thesemiconductor device of FIG. 9, in accordance with an embodiment.

FIGS. 11-13 are cross-sectional views of a semiconductor device atvarious stages of manufacturing, in accordance with an embodiment.

FIG. 14 illustrates an alternative cross-sectional view of thesemiconductor device of FIG. 13, in accordance with an embodiment.

FIG. 15 is a flow chart for a method of forming a semiconductor device,in some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. Unless otherwise specified, like referencenumerals refer to like elements that are formed by a same or similarmaterial using a same or similar method.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Various embodiments disclosed herein are related to forming self-alignedvias (SAVs) in a semiconductor device. In some embodiments, to form anSAV that is electrically coupled to an underlying conductive line, anon-planar etch stop layer (ESL) is formed over the conductive line andover a first dielectric layer in which the conductive line is formed,where the ESL has a first lower surface and a second lower surface thatis spaced apart from (e.g., having an offset with) the first lowersurface. The first lower surface contacts and extends along an uppersurface of the conductive line, and the second lower surface extendsalong an upper surface of the first dielectric layer, where the secondlower surface is further from the conductive line than the first lowersurface. The ESL may have a plurality of sublayers (e.g., conformalsublayers) formed successively over the conductive line and over thefirst dielectric layer. A second dielectric layer is then formed overthe ESL, and an opening is formed in the second dielectric layer toexpose a first portion of the ESL. The first portion of the ESL is thenremoved to expose the underlying conductive line, and a via is formed inthe opening by filling the opening with an electrically conductivematerial(s).

Various methods to form the ESL that has the first lower surface and thesecond lower surface are disclosed. In an embodiment, the conductiveline is formed in the first dielectric layer over a substrate, and then,the conductive line is recessed (e.g., etched) such that the uppersurface of the conductive line is closer to the substrate than the uppersurface of the first dielectric layer. The ESL is then formedconformally over the conductive line and over the first dielectriclayer. In another embodiment, the conductive line is formed in the firstdielectric layer over a substrate such that the upper surface of theconductive line is level with the upper surface of the first dielectriclayer. Next, a third dielectric layer is selectively formed over theupper surface of the first dielectric layer while exposing theconductive line, and the ESL is formed conformally over the conductiveline and over the third dielectric layer. Thereafter, the seconddielectric layer is formed over the ESL.

FIGS. 1-9 are cross-sectional views of a semiconductor device 100 atvarious stages of manufacturing, in accordance with an embodiment. Asillustrated in FIG. 1, the semiconductor device 100 includes a substrate101 and a device region 102 in the substrate 101. The semiconductordevice 100 further includes an etch stop layer (ESL) 103, a dielectriclayer 105, and a film stack 104 over the dielectric layer 105, whichfilm stack 104 further includes a plurality of dielectric layers, suchas dielectric layers 107, 109, 111, and 143.

The substrate 101 may be a semiconductor substrate, such as silicon,doped or undoped, or an active layer of a semiconductor-on-insulator(SOI) substrate. The semiconductor substrate may include othersemiconductor materials, such as germanium; a compound semiconductorincluding silicon carbide, gallium arsenic, gallium phosphide, galliumnitride, indium phosphide, indium arsenide, and/or indium antimonide; analloy semiconductor including SiGe, GaAsP, AlInAs, AlGaAs, GaInAs,GaInP, and/or GaInAsP; or combinations thereof. Other substrates, suchas multi-layered or gradient substrates, may also be used. Devices, suchas transistors, diodes, capacitors, resistors, etc., may be formed inthe device region 102 of the substrate 101. The device region 102 mayfurther include conductive features such as contacts (also referred toas contact plugs), e.g., gate contacts and source/drain contacts, thatare electrically coupled to the gates and the source/drain regions,respectively, of underlying transistors.

The ESL 103 is used to protect the underlying structures and provide acontrol point for a subsequent etching process through, e.g., thedielectric layer 105, and may be formed of a suitable material, such asaluminum oxide (e.g., AlO_(x)), by a suitable method such as chemicalvapor deposition (CVD), physical vapor deposition (PVD), or the like.The dielectric layer 105 may be made of one or more suitable materialssuch as silicon oxide, silicon nitride, low-k dielectrics such as carbondoped oxides, extremely low-k dielectrics such as porous carbon dopedsilicon dioxide, combinations of these, or the like. The dielectriclayer 105 may be formed through a process such as chemical vapordeposition (CVD), although any suitable process may be utilized.

In the example of FIG. 1, the film stack 104 includes the dielectriclayers 107, 109, 111, and 143 formed successively over the dielectriclayer 105. Each of the dielectric layers 107, 109, 111 and 143 may beformed of a suitable dielectric material such as silicon oxide, siliconnitride, silicon carbonitride, silicon carbide, titanium nitride,tetraethyl orthosilicate, or the like. In some embodiments, thedielectric layer 107 comprises an oxide (e.g., silicon oxide) formed oftetraethyl orthosilicate (TEOS) (also referred to as TEOS-formed oxide),the dielectric layer 109 is formed of silicon carbide (e.g., SiC), thedielectric layer 111 is formed of titanium nitride (e.g., TiN), and thedielectric layer 143 is formed of TEOS-formed oxide. Each layer of thefilm stack 104 may be formed of a suitable formation method, such asPVD, CVD, spin-coating, combinations thereof, or the like. The number ofsublayers and the materials of the sublayers in the film stack 104illustrated in FIG. 1 are illustrative and non-limiting, and may bedetermined by factors such as the photolithography and etching processesperformed subsequently. Other numbers of sublayers and other materialsfor the sublayers of the film stack 104 are also possible and are fullyintended to be included in the scope of the present disclosure.

After the film stack 104 is formed, openings 110 are formed in the filmstack 104 using, e.g., photolithography and etching techniques. Theopenings 110 extend through the film stack 104 and expose the dielectriclayer 107. The locations of the openings 110 correspond to locations ofconductive lines 115 (see, e.g., FIGS. 3 and 4) formed subsequently.After the openings 110 are formed, the dielectric layer 143 (e.g.,TEOS-formed oxide) is removed by a suitable process, such as etching, insome embodiments.

Next, in FIG. 2, the openings 110 are extended to form openings 112. Theopenings 112 extend through the dielectric layer 107, the dielectriclayer 105, the ESL 103, and expose the conductive features (e.g., gatecontacts and/or source/drain contacts) in the device region 102. In anembodiment, to form the openings 112, a dry etch process, such as aplasma process, is performed first to extend the opening 110 through thedielectric layers 107 and 105 such that the ESL 103 is exposed. Next, awet etch process is performed to etch through the ESL 103 and to exposethe underlying conductive features in the device region 102. The dryetch process may use an etching gas comprising octafluorocyclobutane(e.g., C₄F₈), tetrafluoromethane (e.g., CF₄), or both. The wet etch mayuse a chemical such as ammonium hydroxide (e.g., NH₄OH).

Next, in FIG. 3, a barrier layer 113 is formed (e.g., conformally) overthe semiconductor device 100. As illustrated in FIG. 3, the barrierlayer 113 lines the sidewalls and the bottoms of openings 112, andextends along the upper surface of the dielectric layer 111. The barrierlayer 113 may comprise an electrically conductive material such astitanium nitride, although other materials, such as tantalum nitride,titanium, tantalum, or the like, may alternatively be utilized. Thebarrier layer 113 may be formed using a CVD process, such asplasma-enhanced CVD (PECVD). However, other alternative processes, suchas sputtering or metal organic chemical vapor deposition (MOCVD), atomiclayer deposition (ALD), may alternatively be used.

Next, a seed layer is formed over the barrier layer 113. The seed layermay include copper, titanium, tantalum, titanium nitride, tantalumnitride, the like, or a combination thereof, and may be deposited byALD, sputtering, PVD, or the like. In some embodiments, the seed layeris a metal layer, which may be a single layer or a composite layercomprising a plurality of sub-layers formed of different materials. Forexample, the seed layer may include a titanium layer and a copper layerover the titanium layer.

Once the seed layer has been formed, a conductive material 115′ isformed over the seed layer. The conductive material 115′ may be asuitable conductive material such as copper, although other suitablematerials such as aluminum, silver, gold, tungsten, rhodium, molybdenum,nickel, cobalt, cadmium, zinc, alloys of these, combinations thereof, orthe like, may alternatively be utilized. The conductive material 115′may be formed by electroplating the conductive material 115′ onto theseed layer, filling and overfilling the openings 112.

Next, in FIG. 4, a planarization process, such as chemical andmechanical planarization (CMP), is performed. In the example of FIG. 4,the planarization process is controlled to stop when the dielectriclayer 105 is exposed, or when a target height H_(L) for the remainingportions of the conductive material 115′ is reached. In someembodiments, the height H_(L) is between about 150 angstroms and about250 angstroms. After the planarization process, the remaining portionsof the conductive material 115′ form conductive lines 115, whichconductive lines 115 have upper surfaces that are level with the uppersurface of the dielectric layer 105 (or the remaining portions thereof).The conductive lines 115 are electrically coupled to the conductivefeatures (e.g., gate contacts and/or source/drain contacts of underlyingtransistors) in the device region 102.

Referring next to FIG. 5, the upper surfaces of the conductive lines 115are recessed such that the upper surfaces of the conductive lines 115are closer to the substrate 101 than the upper surface of the dielectriclayer 105. In some embodiments, an etching process, such as a wet etch,is performed to recess the conductive lines 115. The wet etch may use achemical(s) that is selective to (e.g., having a higher etching ratefor) the material of the conductive lines 115. In the illustratedembodiment, the conductive lines 115 are copper lines, and the chemicalused in the wet etch is ammonium hydroxide (e.g., NH₄OH, may also bereferred to as ammonium solution), which comprises ammonium anddeionized (DI) water.

In some embodiments, the wet etch process is controlled to achieve atarget distance H between the upper surface of the dielectric layer 105and the upper surface of the conductive line 115. The target distance His between about 30 angstroms and about 50 angstroms, in the illustratedembodiment. In some embodiments, if the target distance H is smallerthan about 30 angstroms, some advantages of the present disclosure, suchas reduced leakage current and reduced chance of electrical short (seediscussion below with reference to FIG. 8), may not be sufficientlyachieved. On the other hand, if the target distance H is larger than 50angstroms, there may be too much loss of material for the conductiveline 115, and the electrical resistance of the conductive line 115 maybe too high. In some embodiments, the duration of the wet etch and/orthe pH value of the ammonium solution are controlled to achieve atargeted amount of recessing for the conductive line 115 (thus thedistance H). For example, the duration of the wet etch process may becontrolled to last for about 2 minutes to about 3 minutes, and the pHvalue of the ammonium solution may be controlled to be between about 9and about 11. In some embodiments, the conductive line 115 is formed ofcopper, and the barrier layer 113 is formed of tantalum, tantalumnitride, and/or cobalt, by controlling the pH value between about 9 andabout 11, an etching selectivity of the ammonium solution between theconductive line 115 and the barrier layer 113 is achieved. To controlthe pH value, electrodes may be submerged in the ammonium solution usedin the wet etch process, and electrical current may be applied to theelectrodes to adjust the pH value of the ammonium solution. After thewet etch process, recesses 114 are formed in the dielectric layer 105(e.g., over the upper surfaces of the conductive lines 115).

Next, in FIG. 6, an ESL 117 is formed (e.g., conformally) over thesemiconductor device 100 of FIG. 5, and a protection layer 119 is formed(e.g., conformally) over the ESL 117. The ESL 117 extends along theupper surface of the dielectric layer 105, and lines the sidewalls andthe bottoms of the recesses 114. The ESL 117 may be formed of anysuitable dielectric material such as silicon nitride, siliconcarbonitride, combinations thereof, or the like. In an embodiment, theESL 117 is formed of aluminum oxide (e.g., AlO_(x)), and the protectionlayer 119 is formed of oxygen doped carbide (ODC). Since ODC ishydrophobic, the protection layer 119 prevents or reduces moisturerelated damages to the conductive lines 115, such as oxidization orerosion, in some embodiments. Due to the recesses 114, the ESL 117 isnon-planar, and has a lower surface 117L1 that physically contacts andextends along the upper surface of the dielectric layer 105. The ESL 117also has another lower surface 117L2 that physically contacts andextends along the upper surface of the conductive lines 115. The lowersurface 117L2 is closer to the substrate 101 than the lower surface117L1. In the illustrated example, the lower surfaces 117L1 is parallel(e.g., parallel within the limitations of manufacturing) to the uppersurface of the substrate 101. Although the conductive line 115 isillustrated to have a flat upper surface, depending on various factors(e.g., pH value of the ammonium solution) of the wet etch process usedto recess the conductive line 115, the conductive line 115 may have anon-flat upper surface, such as a concave upper surface.

In some embodiments, the ESL 117 comprises aluminum oxide, and is formedby a CVD process using a precursor comprising oxygen (such as O₂ andCO₂) and a precursor comprising aluminum radicals. A thickness of theESL 117 is between about 20 angstroms and about 30 angstroms. In someembodiments, the protection layer 119 comprises oxygen doped carbide,and is formed by a PVD process. A thickness of the protection layer 119is between about 30 angstroms and about 70 angstroms, such as 50angstroms.

Referring next to FIG. 7, a dielectric layer 121 is formed over theprotection layer 119 and the ESL 117, and a film stack 124 is formedover the dielectric layer 121. The dielectric layer 121 may comprise asame or similar material as the dielectric layer 105, and may be formedby a same or similar method, thus details are not repeated. The filmstack 124 may include a dielectric layer 123 (e.g., a TEOS-formed oxidelayer), a dielectric layer 125 (e.g., a silicon carbide layer), and adielectric layer 128 (e.g., a titanium nitride layer) that are formed bysuitable formation methods, such as CVD, PVD, spin-coating, combinationsthereof, or the like. The number of sublayers and the materials of thesublayers in the film stack 124 illustrated in FIG. 7 are illustrativeand non-limiting, and may be determined by factors such as thephotolithography and etching processes performed subsequently. Othernumbers of sublayers and other materials for the sublayers of the filmstack 124 are also possible and are fully intended to be included in thescope of the present disclosure.

Next, the film stack 124, the dielectric layer 121, and the protectionlayer 119 are patterned, e.g., using photolithograph and etchingtechniques, to form openings 126. The openings 126 may be formed usingone or more etching processes, e.g., using a dual-damascene etchingprocess such that each of the openings 126 has an upper trench 126U andone or more lower trenches 126L. As illustrated in FIG. 7, the openings126 extend through the film stack 124, the dielectric layer 121, theprotection layer 119, and expose the ESL 117. In the illustratedembodiment, the etching process(es) to form the openings 126 may beselective to the materials of the dielectric layer 121, the film stack124, and the protection layer 119, and therefore, the ESL 117 remainsubstantially un-etched after the etching process(es). The number ofconductive lines 115, the number of openings 126, the relative locationsof the conductive lines 115 and the relative locations of the openings126 in FIG. 7 are illustrative and non-limiting, other numbers and otherrelative locations are also possible and are fully intended to beincluded within the scope of the present disclosure.

In some embodiments, a plasma etching process is performed to form theopenings 126. The plasma etching process may be performed under apressure between about 20 mTorr and about 80 mTorr, and at a temperaturebetween about 0° C. and about 50° C. The plasma etching process may usea gas comprising a compound of carbon and fluoride, which is denoted asC_(x)F_(y) (e.g., CF₄, or C₄F₈). In an embodiment, the plasma etchingprocess uses a gas mixture comprising C_(x)F_(y), N₂, O₂ and Ar. A flowrate of C_(x)F_(y) may be between about 20 standard cubic centimetersper minute (sccm) and about 50 sccm, a flow rate of N₂ may be betweenabout 10 sccm and about 100 sccm, a flow rate of O₂ may be between about5 sccm and about 25 sccm, and a flow rate of Ar may be between about 600sccm and about 1200 sccm. In addition, the gas mixture may optionallyinclude H₂ or CH_(x)F_(y) to control the profile (e.g., profile of thesidewalls of the dielectric layer 121 exposed by the openings 126) ofthe dielectric layer 121 (e.g., silicon oxide) during the etching. Forexample, an H-containing gas (e.g., H₂) may be added to the gas mixtureto control depth loading and to control the critical dimension (CD) ofthe vias (see, e.g., 129V in FIG. 8) to be formed subsequently. TheH-containing gas may help shrink the CD of the vias (e.g., by shrinkingthe CD of the lower trench 126L) and control metal depth loading ondifferent CDs of the vias. In embodiment where H₂ is used in the gasmixture, the flow rate of H₂ is between about 0 sccm and about 100 sccm.In embodiment where CH_(x)F_(y) is used in the gas mixture, the flowrate of CH_(x)F_(y) is between about 0 sccm and about 100 sccm.

To activate the gas mixture into plasma, a radio frequency (RF) sourceis used, which RF source may have a voltage supply between about 0 voltand about 1000 volts, and may have an RF power between, e.g., about 200watts and about 500 watts with different source frequencies. The RFpower may be adjusted for different aspect ratios of the openings (e.g.,126U, 126L) to maintain a target etching capability. For example, the RFsource may have an RF power between about 200 watts and about 500 wattsat the beginning of the plasma etching process, and as the plasmaetching process proceeds, the RF power may be increased to between about200 watts and about 1000 watts.

Next, in FIG. 8, portions of the ESL 117 exposed by the openings 126(e.g., 126L) are removed to expose the underlying conductive lines 115.The upper surface of the dielectric layer 105 may also be exposed by theremoval of the ESL 117, e.g., due to misalignment between the openings126 and the respective conductive lines 115. In other words, theopenings 126 are extended by the removal of the ESL 117 to expose theconductive lines 115 and to expose the upper surface of the dielectriclayer 105. In an embodiment, a wet etch process using afluoride-containing chemical is performed to remove the exposed portionsof the ESL 117. In some embodiments, the pH value of thefluoride-containing chemical is controlled to be neutral (e.g., pH valueis 7) during the wet etch process, such that the fluoride-containingchemical selectively removes the exposed portions of the ESL 117 withoutsubstantially attacking the underlying conductive line 115.

Next, a barrier layer 127 is formed (e.g., conformally) lining sidewallsand bottoms of the (extended) openings 126. The barrier layer 127 alsophysically contacts and extends along the exposed upper surface of thedielectric layer 105. A seed layer is then formed over the barrier layer127, and an electrically conductive material 129, such as a fill metal,is formed over the seed layer to fill the openings 126. Portions of theconductive material 129 filling the lower trenches 126L form the vias129V.

As feature size in semiconductor manufacturing continues to shrink, ithas become increasingly difficult to control the alignment betweendifferent features formed on different layers of the semiconductordevice. For example, photolithography and etching techniques use masks(also referred to as photo masks) to control the exposure and to formdifferent features in different layers of the semiconductor device. Inadvanced processing nodes, minute shift between masks may occur(referred to as overlay shift), which will cause features formed indifferent layers to have unintended offsets (e.g., location change) fromthe original design locations.

In the example of FIG. 8, due to overlay shift, the center axis 129VC ofthe via 129V (see also FIG. 9) has an offset A from the center axis 115Cof a respective conductive line 115 underlying the via 129V. As a resultof the offset A, the lower surface of the via 129V, which may beoriginally designed to have substantially a same width as the uppersurface of the conductive line 115, is not aligned perfectly with theupper surface of the respective conductive line 115. Therefore, aportion of the lower surface of the via 129V extends beyond sidewalls ofthe respective conductive line 115. Since the barrier layer 127 isconformal to the surfaces of the via 129V, the misalignment between thevia 129V and the underlying conductive line 115 causes the barrier layer127 to have a first portion 127L covering (e.g., physically contactingand extending along) the upper surface of the underlying conductive line115, and to have a second portion 127A contacting and extending alongthe upper surface of a portion of the dielectric layer 105 immediatelyadjacent to the underlying conductive line 115. As illustrated in FIG.8, due to the overlay shift, a portion of the ESL 117 and a portion ofthe protection layer 119 disposed on the upper surface of the conductiveline 115 is not removed by the plasma etching process, and therefore,remain on the upper surface of the conductive line 115. Furthermore, inFIG. 8, the upper surface of the portion of dielectric layer 105 betweenadjacent conductive lines 115 has a first portion covered by the barrierlayer 127 (e.g., 127A), and has a second portion covered by the ESL 117(e.g., a portion of 117 labeled as 117A).

In FIG. 8, the second portion 127A of the barrier layer 127 and aportion of the via 129V directly above the second portion 127A extendupward above the upper surface of the conductive line 115. This upwardextension of the via 129V helps to maintains a minimum distance Dbetween the via 129V and a laterally adjacent (e.g., immediatelyadjacent) conductive line 115, where the minimum distance D is equal toa distance between adjacent conductive lines 115 in the illustratedexample. The ability to maintain a minimum distance D between the via129V and adjacent conductive lines 115 improves device performance byreducing the leakage current between the via 129V and adjacentconductive lines 115, and by reducing the chance of electrical short(e.g., short circuit) between the via 129V and adjacent conductive lines115, which illustrates an advantage of the present disclosed methods.

The above described advantage may be better appreciated by considering areference design where the conductive lines 115 are not recessed, andthe ESL 117 is formed as a flat (e.g., planar) layer over the conductiveline 115 and over the dielectric layer 105, in which case the overlayshift would cause the via 129V to shift laterally toward a laterallyadjacent conductive line 115, which may results in short circuit and/orincreased leakage current. As another example to illustrate theadvantage of the presently disclosed methods, consider a scenario wherethe etching process to remove the exposed (e.g., exposed by the opening126 in FIG. 7) portions of the ESL 117 over-etches and removes portionsof the dielectric layer 105 under the exposed portions of the ESL 117.The overlay shift and the over-etching would cause recesses to be formedimmediately adjacent the conductive lines 115 in the above mentionedreferences design, and these recesses would be filled when theconductive material 129 is formed, thereby forming unwanted portions ofthe conductive material 129 between adjacent conductive lines 115, whichmay cause increased leakage current and/or electrical short. Incontrast, the presently disclosed methods, due to the conductive lines115 being recessed from the upper surface of the dielectric layer 105,provides improved tolerance for over-etching and may still be able tomaintain a minimum distance D between the via 129V and the adjacentconductive lines 115, thus reducing leakage current and/or theoccurrence of electrical short.

Recall that in the processing of FIG. 5, the wet etch process to recessthe conductive line 115 is controlled to achieve a distance H betweenthe upper surface of the dielectric layer 105 and the upper surface ofthe conductive line 115, where the distance H is between about 30angstroms and about 50 angstroms. The lower boundary (e.g., 30angstroms) of the distance H is chosen to provide a target level ofprotection against over-etching. For example, by having a minimumdistance H of about 30 angstroms, in the subsequent etching process toremove exposed portions of the ESL 117, an over-etching of 30 angstromsmay be tolerated without causing a reduction of the minimum distance Dbetween the via 129V and the adjacent conductive lines 115. If thedistance H is too small (e.g., smaller than about 30 angstroms), thelevel of protection against over-etching may not be enough, andover-etching may result in reduction of the minimum distance D, which inturn may result in increased current leakage and/or electrical short. Onthe other hand, if the distance H too large (e.g., larger than about 50angstroms), the aspect ratio (e.g., height over width) of the recesses114 (see FIG. 5) may be too large, and it may be difficult to form theconformal ESL 117 in the recesses 114, and therefore, discontinuity(e.g., holes) may occur in the ESL 117 formed, which negatively affectthe function of the ESL 117 and may result in increased leakage currentand/or short circuit.

Referring now to FIG. 9, a planarization process, such as CMP, isperformed to remove layers over the dielectric layer 121. After theplanarization process, remaining portions of the conductive material 129in the upper trench 126U (see FIG. 7) form conductive lines 129L, andremaining portions of the conductive material 129 in the lower trench126L (see FIG. 7) form the vias 129V.

Next, an ESL 131 is formed over the dielectric layer 121 and over theconductive lines 129L, and a protection layer 133 is formed over the ESL131. The ESL 131 may be the same or similar to the ESL 117 (e.g.,AlO_(x)), and the protection layer 133 may be the same or similar to theprotection layer 119 (e.g., ODC), thus details are not repeated. Next,additional dielectric layers, such as a dielectric layer 135 (which maybe the same or similar as the dielectric layer 105) and a dielectriclayer 137 (which may be a TEOS-formed oxide layer) are formed over theprotection layer 133, and conductive lines 141 with barrier layer 139are formed in the dielectric layers 135 and 137, using processing stepssimilar to those described above. Additional processing may be performedafter the processing of FIG. 9 to fabricate the semiconductor device100, as skilled artisans readily appreciate. Details are not discussedhere.

Depending on factors such as the width of the vias 129V, the width ofthe conductive lines 115, and the offset A (see FIG. 8) between thecenter axis 129VC of the via 129V and the center axis 115C of theconductive line 115, the semiconductor device 100 may have differentcross-sectional views than FIG. 9. For example, FIG. 10 illustrates analternative cross-sectional view of the semiconductor device 100 of FIG.9, when the width of the via 129V is larger than the sum of the width ofthe underlying conductive line 115 and the offset A. As a result, in theexample of FIG. 10, the barrier layer 127 completely covers the uppersurface of the underlying conductive line 115 that is electricallycoupled to the via 129V. In addition, portions of the barrier layer 127(e.g., 127A) disposed beyond the sidewalls of the conductive line 115extend upwards along the upper surface of the dielectric layer 105,which helps to maintain the minimum distance D between the via 129V andthe laterally adjacent conductive line 115, thereby reducing the leakagecurrent and/or possibility of electrical short. In FIG. 10, the uppersurface of the portion of dielectric layer 105 between adjacentconductive lines 115 has a first portion covered by the barrier layer127 (e.g., 127A), and has a second portion covered by the ESL 117 (e.g.,117A). As illustrated in FIGS. 9 and 10, the ESL 117 and the recessedconductive line 115 help to the vias 129V to be formed in a self-alignedmanner.

FIGS. 11-13 are cross-sectional views of a semiconductor device 200 atvarious stages of manufacturing, in accordance with an embodiment. Theprocessing of FIG. 11 may follow the processing illustrated in FIG. 4,and therefore, FIGS. 1-4, and 11-13 illustrate another embodimentprocessing method.

In FIG. 11, a dielectric layer 106 is selectively formed on the uppersurface of the dielectric layer 105. In some embodiments, the dielectriclayer 106 comprises silicon oxide, and is formed by a deposition process(e.g., a CVD process) using a first precursor comprising silane (e.g.,SiH₄) and a second precursor comprising oxygen (e.g., O₂). Since theupper surfaces of the conductive lines 115 (e.g., copper) are notconducive to the formation of silicon oxide, the deposition rate ofsilicon oxide on the dielectric layer 105 (e.g., silicon oxide) is muchhigher than that on the conductive lines 115, in the illustratedembodiment. As a result, the dielectric layer 106 is selectively formedon the dielectric layer 105, while little or no dielectric layer 106 isformed over the conductive lines 115. In other embodiments, thedielectric layer 106 may be blanket deposited over the dielectric layer105 and over the conductive lines 115, and a subsequent etching processmay be performed (e.g., using photolithography and etching techniques)to remove portions of the dielectric layer 106 over the conductive lines115.

In some embodiments, during the deposition process for the dielectriclayer 106, a flow rate of silane is in a range between about 50 sccm andabout 100 sccm, and a flow rate of oxygen is in a range between about 5sccm and about 10 sccm. A temperature of the deposition process isbetween about 300° C. and about 500° C., and a pressure of thedeposition process is between about 75 mTorr and about 200 mTorr, insome embodiments. A thickness of the dielectric layer 106 formed isbetween about 30 angstroms and about 50 angstroms, such that the uppersurfaces of the conductive lines 115 are recessed from the upper surfaceof the dielectric layer 106 by a distance H that is equal to thethickness of the dielectric layer 106. As illustrated in FIG. 11,recesses 114′ are formed in the dielectric layer 106 over the conductivelines 115.

Next, in FIG. 12, the ESL 117 and the protection layer 119 are formedsuccessively over the upper surface of the dielectric layer 106 andalong sidewalls and bottoms of the recesses 114′. Details are the sameor similar to those discussed above with reference to FIG. 6, thus notrepeated here.

Due to the recesses 114′, the ESL 117 is non-planar, and has a lowersurface 117L1 that physically contacts and extends along the uppersurface of the dielectric layer 106. The ESL 117 also has another lowersurface 117L2 that physically contacts and extends along the uppersurface of the conductive line 115. The lower surface 117L2 is closer tothe substrate 101 than the lower surface 117L1. In the illustratedexample, the lower surfaces 117L1 and 117L2 are parallel (e.g., parallelwithin the limitations of manufacturing) to each other, and are parallel(e.g., parallel within the limitations of manufacturing) to the uppersurface of the substrate 101.

Next, in FIG. 13, processing steps same or similar to those illustratedin FIGS. 7 and 8 are performed to form the semiconductor device 200illustrated in FIG. 13. In particular, the dielectric layer 121 isformed over the protection layer 119, and a film stack, which includes aplurality of dielectric layers (e.g., 123, 125) are formed over thedielectric layer 121. Next, openings (see, e.g., 126 in FIG. 7) areformed in the dielectric layer 121 to expose portions of the ESL 117.The exposed portions of the ESL 117 are then removed to expose theunderlying conductive lines 115. Next, the barrier layer 127 is formed,followed by the formation of the seed layer and the conductive material129 over the seed layer. Details are the same or similar to thediscussion above with reference to FIGS. 7 and 8, thus are not repeatedhere.

In FIG. 13, the ESL 117 covers a first portion of the upper surface ofthe conductive line 115 (e.g., the leftmost or the rightmost conductiveline 115 in FIG. 13) electrically coupled to a respective via 129V, andthe barrier layer 127 (e.g., 127L) covers a second portion of the uppersurface of the conductive line 115. In addition, the upper surface ofthe portion of dielectric layer 105 between adjacent conductive lines115 has a first portion covered by the barrier layer 127 (e.g., 127A),and has a second portion covered by the ESL 117 (e.g., 117A). Additionalprocessing may be performed after the processing of FIG. 13 to fabricatethe semiconductor device 200, as skilled artisans readily appreciate.Details are not discussed here.

Depending on factors such as the width of the vias 129V, the width ofthe conductive lines 115, and the offset A (see FIG. 8) between thecenter axis 129VC of the via 129V and the center axis 115C of theconductive line 115, the semiconductor device 200 may have a differentcross-sectional view than FIG. 13. FIG. 14 is an alternativecross-sectional views of the semiconductor device 200 of FIG. 12, wherethe width of the via 129V is larger than the sum of the width of theunderlying conductive line 115 and the offset A. As a result, in theexample of FIG. 14, the barrier layer 127 completely covers the uppersurface of the underlying conductive line 115 electrically coupled tothe via 129V. In addition, portions of the barrier layer 127 (e.g.,127A) disposed beyond the sidewalls of the conductive line 115 extendupwards along the upper surface of the dielectric layer 105, which helpsto maintain the minimum distance D between the via 129V and thelaterally adjacent conductive line 115, thereby reducing the leakagecurrent and/or possibility of electrical short. In FIG. 14, the uppersurface of the portion of dielectric layer 105 between adjacentconductive lines 115 has a first portion covered by the barrier layer127 (e.g., 127A), and has a second portion covered by the ESL 117 (e.g.,117A).

Variations to the disclosed embodiments are possible and are fullyintended to be included in the scope of the present disclosure. Forexample, while the various embodiments disclosed herein uses formationof the first via layer (also referred to as Via0 layer) over the devices(e.g., transistors) in the device region 102 as examples, the disclosedmethods may be applied to other via layers over the first via layers.While the vias 129V and the conductive lines 129L are illustrated asbeing formed in a dual-damascene process, any suitable process may beused to form the conductive lines 129L and the vias 129V.

FIG. 15 is a flow chart of a method of fabricating a semiconductorstructure, in accordance with some embodiments. It should be understoodthat the embodiment method shown in FIG. 15 is merely an example of manypossible embodiment methods. One of ordinary skill in the art wouldrecognize many variations, alternatives, and modifications. For example,various steps as illustrated in FIG. 15 may be added, removed, replaced,rearranged and repeated.

Referring to FIG. 15, at block 1010, a conductive line is formed over asubstrate. At block 1020, an etch stop layer (ESL) is formed over theconductive line, the ESL extending continuously along an upper surfaceof the conductive line and along an upper surface of a first dielectriclayer adjacent to the conductive line, wherein a first lower surface ofthe ESL contacts the upper surface of the conductive line, and a secondlower surface of the ESL contacts the upper surface of the firstdielectric layer, the first lower surface being closer to the substratethan the second lower surface. At block 1030, a second dielectric layeris formed over the ESL. At block 1040, an opening is formed in thesecond dielectric layer, the opening exposing a first portion of theESL. At block 1050, the first portion of the ESL is removed to exposethe conductive line. At block 1060, the opening is filled with anelectrically conductive material to form a via.

Embodiments may achieve advantages. For example, by recessing theconductive lines 115 below the upper surface of the dielectric layer 105(see, e.g., FIG. 6), or by selectively forming the dielectric layer 106over the dielectric layer 105 (see, e.g., FIG. 12), the ESL 117 is anon-planar layer, with a first lower surface contacting the conductivelines 115 and a second lower surface higher than the first lowersurface. The distance H between the first lower surface and the secondlower surface provides protection against over-etching of the ESL 117,and help to maintain a minimum distance D between the via 129V andlaterally adjacent conductive lines 115, thus reducing the leakagecurrent and/or the possibility of short circuit. The vias 129V areformed in a self-aligned manner due to the shape of the non-planar ESL117, which may reduce the precision requirements for thephotolithography process to form the openings 126, which in turn reducesmanufacturing cost.

In an embodiment, a method of forming a semiconductor device includesforming a conductive line over a substrate; forming an etch stop layer(ESL) over the conductive line, the ESL extending continuously along anupper surface of the conductive line and along an upper surface of afirst dielectric layer adjacent to the conductive line, where a firstlower surface of the ESL contacts the upper surface of the conductiveline, and a second lower surface of the ESL contacts the upper surfaceof the first dielectric layer, the first lower surface being closer tothe substrate than the second lower surface; forming a second dielectriclayer over the ESL; forming an opening in the second dielectric layer,the opening exposing a first portion of the ESL; removing the firstportion of the ESL to expose the conductive line; and filling theopening with an electrically conductive material to form a via. In anembodiment, forming the conductive line includes forming the conductiveline in the first dielectric layer such that the conductive line and thefirst dielectric layer have a same level upper surface, wherein formingthe etch stop layer includes: recessing the upper surface of theconductive line below the upper surface of the first dielectric layer;and conformally forming the ESL over the upper surface of the firstdielectric layer and over the recessed upper surface of the conductiveline. In an embodiment, recessing the upper surface of the conductiveline includes performing a wet etch that is selective to the conductiveline. In an embodiment, the conductive line is a copper line, andwherein the wet etch is performed using ammonium hydroxide. In anembodiment, conformally forming the ESL includes conformally forming alayer comprising metal oxide over the upper surface of the firstdielectric layer and over the recessed upper surface of the conductiveline, where the method further includes conformally forming a layercomprising a dielectric material over the ESL before forming the seconddielectric layer. In an embodiment, filling the opening includes forminga barrier layer lining a bottom and sidewalls of the opening; andfilling the opening with a metal material. In an embodiment, the barrierlayer covers a first portion of the upper surface of the conductiveline, wherein the ESL covers a second portion of the upper surface ofthe conductive line. In an embodiment, forming the conductive lineincludes forming the conductive line in a third dielectric layer suchthat the conductive line and the third dielectric layer have a samelevel upper surface distal the substrate, wherein forming the etch stoplayer includes selectively forming the first dielectric layer over thethird dielectric layer, the first dielectric layer exposing the uppersurface of the conductive line; and conformally forming the ESL over theupper surface of the first dielectric layer and over the upper surfaceof the conductive line. In an embodiment, selectively forming the firstdielectric layer includes performing a deposition process using a firstprecursor comprising silicon and a second precursor comprising oxygen.In an embodiment, a distance between the first lower surface of the ESLand the second lower surface of the ESL is between about 30 angstromsand about 50 angstroms.

In an embodiment, a method of forming a semiconductor device includesforming a conductive line in a first dielectric layer over a substrate,an upper surface of the conductive line being exposed at an uppersurface of the first dielectric layer; selectively forming a seconddielectric layer on the upper surface of the first dielectric layer, anupper surface of the second dielectric layer extending further from thesubstrate than the upper surface of the conductive line; forming a thirddielectric layer over the second dielectric layer and the conductiveline; forming an opening in the third dielectric layer, the openingexposing a first portion of the upper surface of the conducive line anda second portion of the upper surface of the second dielectric layer;and forming a via in the opening, the via being electrically coupled tothe conductive line, a lower surface of the via extending along thefirst portion of the upper surface of the conductive line and the secondportion of the upper surface of the second dielectric layer. In anembodiment, the upper surface of the conductive line is formed to belevel with the upper surface of the first dielectric layer. In anembodiment, the second dielectric layer comprises silicon oxide, whereinselectively forming the second dielectric layer includes selectivelyforming the second dielectric layer using a first precursor comprisingsilicon and a second precursor comprising oxygen. In an embodiment, theupper surface of the second dielectric layer extends further from thesubstrate than the upper surface of the conductive line by a distancebetween about 30 angstroms and about 50 angstroms. In an embodiment, themethod further includes, before forming the third dielectric layer,forming a conformal etch stop layer over the upper surface of theconductive line and over the upper surface of the second dielectriclayer. In an embodiment, forming the opening in the third dielectriclayer includes performing a dry etch process to form a first opening inthe third dielectric layer, the first opening exposing a portion of theconformal etch stop layer; and performing a wet etch process to removethe exposed portion of the conformal etch stop layer.

In an embodiment, a semiconductor device includes a first dielectriclayer over a substrate; a conductive line in the first dielectric layer;a second dielectric layer over the first dielectric layer and theconductive line; and a via in the second dielectric layer andelectrically coupled to the conductive line, wherein the via hasopposing sidewalls and a bottom surface between the opposing sidewalls,wherein a first portion of the bottom surface of the via extends alongan upper surface of the conductive line, and a second portion of thebottom surface of the via extends further from the substrate than thefirst portion. In an embodiment, an upper surface of the conductive linedistal the substrate is closer to the substrate than an upper surface ofthe first dielectric layer distal the substrate. In an embodiment, thesemiconductor device further includes a third dielectric layer betweenthe first dielectric layer and the second dielectric layer, wherein thesecond portion of the bottom surface of the via extends along an uppersurface of the third dielectric layer distal the substrate. In anembodiment, the semiconductor device further includes an etch stop layerbetween the third dielectric layer and the second dielectric layer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of forming a semiconductor device, themethod comprising: forming a first dielectric layer over a substrate;forming a conductive line in the first dielectric layer, wherein formingthe conductive line comprises: forming a first dielectric film and asecond dielectric film successively over the first dielectric layer;forming a recess in the second dielectric film using a first etchingprocess, wherein after the first etching process, an upper surface ofthe first dielectric film distal from the substrate is exposed at abottom of the recess; after the first etching process, extending therecess through the first dielectric film and the first dielectric layerusing a second etching process different from the first etching process;after extending the recess, filling the recess with a first electricallyconductive material, wherein the first electrically conductive materialextends along sidewalls of the first dielectric layer, sidewalls of thefirst dielectric film, and sidewalls of the second dielectric film; andafter filling the recess, performing a planarization process to removethe first dielectric film, the second dielectric film, and portions ofthe first electrically conductive material embedded in the firstdielectric film and the second dielectric film, wherein remainingportions of the first electrically conductive material embedded in thefirst dielectric layer form the conductive line; forming an etch stoplayer (ESL) over the conductive line and over an upper surface of thefirst dielectric layer distal from the substrate, wherein a first lowersurface of the ESL contacting an upper surface of the conductive line iscloser to the substrate than a second lower surface of the ESL over theupper surface of the first dielectric layer; forming a second dielectriclayer over the ESL; forming an opening in the second dielectric layer,the opening exposing a first portion of the ESL disposed on theconductive line, exposing a second portion of the ESL disposed along afirst sidewall of the first dielectric layer, and exposing a thirdportion of the ESL disposed on the upper surface of the first dielectriclayer, wherein the second portion of the ESL connects the first portionand the third portion of the ESL; removing the first portion of the ESLto expose the conductive line and removing the second portion and thethird portion of the ESL to expose the first sidewall and the uppersurface of the first dielectric layer; and filling the opening with asecond electrically conductive material to form a via.
 2. The method ofclaim 1, further comprising, after forming the ESL and before formingthe second dielectric layer, forming a protection layer over the ESL,wherein the protection layer and the ESL are formed of differentmaterials.
 3. The method of claim 2, wherein the opening in the seconddielectric layer is formed to extend through the protection layer. 4.The method of claim 2, wherein the ESL is formed of aluminum oxide, andthe protection layer is formed of oxygen doped carbide (ODC).
 5. Themethod of claim 1, wherein the planarization process achieves a coplanarupper surface between the conductive line and the first dielectriclayer.
 6. The method of claim 5, further comprising, after performingthe planarization process and before forming the ESL: recessing theupper surface of the conductive line below the upper surface of thefirst dielectric layer, wherein forming the ESL comprises conformallyforming the ESL over the upper surface of the first dielectric layer andover the recessed upper surface of the conductive line.
 7. The method ofclaim 6, wherein recessing the upper surface of the conductive linecomprises selectively etching the conductive line using a wet etchprocess.
 8. The method of claim 5, further comprising, after performingthe planarization process and before forming the ESL: selectivelyforming a third dielectric layer over the first dielectric layer, thethird dielectric layer exposing the upper surface of the conductiveline, wherein forming the ESL comprises conformally forming the ESL overan upper surface of the third dielectric layer and over the uppersurface of the conductive line.
 9. The method of claim 8, whereinselectively forming the third dielectric layer comprises performing adeposition process using a first precursor comprising silicon and asecond precursor comprising oxygen.
 10. The method of claim 1, wherein avertical offset between the first lower surface of the ESL and thesecond lower surface of the ESL is between about 30 angstroms and about50 angstroms.
 11. A method of forming a semiconductor device, the methodcomprising: forming a first dielectric layer over a substrate; afterforming the first dielectric layer, forming a conductive line in thefirst dielectric layer, wherein an upper surface of the conductive linedistal from the substrate is formed to be level with an upper surface ofthe first dielectric layer; after forming the conductive line,selectively depositing a second dielectric layer on the upper surface ofthe first dielectric layer without an intervening process, wherein afterselectively depositing the second dielectric layer, the upper surface ofthe first dielectric layer is covered by the second dielectric layer,the upper surface of the conductive line is exposed by the seconddielectric layer, and an upper surface of the second dielectric layerextends further from the substrate than the upper surface of theconductive line; forming a third dielectric layer over the seconddielectric layer and the conductive line; forming an opening in thethird dielectric layer, the opening exposing a first portion of theupper surface of the conducive line and a second portion of the uppersurface of the second dielectric layer; and forming a via by filling theopening with a conductive material.
 12. The method of claim 11, furthercomprising, before forming the third dielectric layer, forming an etchstop layer over the upper surface of the conductive line and over theupper surface of the second dielectric layer.
 13. The method of claim12, wherein forming the opening in the third dielectric layer comprises:performing a dry etch process to form a first opening in the thirddielectric layer, a bottom of the first opening exposing a portion ofthe etch stop layer; and after performing the dry etch process,performing a wet etch process to remove the exposed portion of the etchstop layer.
 14. The method of claim 12, further comprising, afterforming the etch stop layer and before forming the third dielectriclayer, forming a protection layer over the etch stop layer, wherein theprotection layer and the etch stop layer are formed of differentmaterials.
 15. The method of claim 14, wherein the protection layer isformed of a hydrophobic material.
 16. The method of claim 11, whereinforming the conductive line comprises: forming a film stack over thefirst dielectric layer by forming a first dielectric film and a seconddielectric film successively over the first dielectric layer; forming arecess in the film stack using a first etching process, the recessextending through the second dielectric film but not through the firstdielectric film, wherein after the first etching process, an uppersurface of the first dielectric film distal from the substrate isexposed at a bottom of the recess; after the first etching process,performing a second etching process different from the first etchingprocess to extend the recess through the first dielectric film and thefirst dielectric layer; after the second etching process, filling therecess with an electrically conductive material; and after filling therecess, removing the first dielectric film, the second dielectric film,and portions of the electrically conductive material embedded in thefirst dielectric film and the second dielectric film, wherein remainingportions of the electrically conductive material embedded in the firstdielectric layer form the conductive line.
 17. A method of forming asemiconductor device, the method comprising: forming a first dielectriclayer over a substrate; after forming the first dielectric layer,forming a conductive line in the first dielectric layer, wherein anupper surface of the conductive line distal from the substrate is levelwith an upper surface of the first dielectric layer; after forming theconductive line, selectively depositing a second dielectric layer overthe first dielectric layer without an intervening process, wherein afterselectively forming the second dielectric layer, the second dielectriclayer covers the upper surface of the first dielectric layer and exposesthe upper surface of the conductive line; forming a third dielectriclayer over the second dielectric layer and the conductive line; andforming a via in the third dielectric layer and electrically coupled tothe conductive line, wherein the via has a bottom surface facing theconductive line, wherein a first portion of the bottom surface of thevia extends along the upper surface of the conductive line, and a secondportion of the bottom surface of the via extends further from thesubstrate than the first portion.
 18. The method of claim 17, whereinthe second portion of the bottom surface of the via is formed to extendalong an upper surface of the second dielectric layer distal from thesubstrate.
 19. The method of claim 17, further comprising, afterselectively depositing the second dielectric layer and before formingthe third dielectric layer: forming an etch stop layer over the uppersurface of the conductive line and over an upper surface of the seconddielectric layer; and forming a protection layer over the etch stoplayer, wherein the protection layer and the etch stop layer are formedof different materials.
 20. The method of claim 19, wherein theprotection layer is formed of a hydrophobic material.